Hōʻike huahana
P675R Bimetallic Strip (0.16mm Mānoanoa × 27mm Laulā)
Nānā Huahana
ʻO ka P675R bimetallic strip (0.16mm × 27mm), he mea hana pono i hana ʻia mai Tankii Alloy Material, he ʻāpana hui kūikawā i haku ʻia me ʻelua mau ʻāpana like ʻole me nā coefficients hoʻonui wela ʻokoʻa-i hoʻopaʻa paʻa ʻia ma o kā mākou ʻenehana hoʻopaʻa wela a me ka diffusion hoʻopaʻa. Me ka anana lahilahi paʻa o 0.16mm a me ka laula maʻamau o 27mm, ua optimized keia strip no ka miniaturized wela-koʻikoʻi palapala noi, kahi pololei thermal actuation, stable dimensionality, a me ka lewa-ola hoʻolālā. Me ka hoʻohana ʻana i ko Huona akamai i ka hana bimetallic composite, hāʻawi ka papa P675R i ka hana hoʻololi ʻana i ka wela, ʻoi aku ka maikaʻi o nā ʻāpana bimetallic maʻamau i ka hoʻohālikelike ʻana i ka micro-device a me ke kūpaʻa luhi lōʻihi-e lilo ia i mea kūpono no nā thermostats compact, nā mea pale wela, a me nā ʻāpana uku pānaʻi.
Nā koho maʻamau a me ka hoʻokumu kumu
- Papa Huahana: P675R
- Nānā Manaʻo: 0.16mm mānoanoa (ka hoʻomanawanui: ± 0.005mm) × 27mm laula (hoʻomanawanui: ± 0.1mm)
- Hoʻokumu ʻia ʻo Composite: Hōʻike maʻamau i kahi "papa hoʻonui kiʻekiʻe" a me kahi "papa hoʻonui haʻahaʻa", me ka ikaika shear interfacial ≥160 MPa
- Nā Kūlana Kūlike: Hoʻopili i ka GB/T 14985-2017 (ka maʻamau Kina no nā ʻāpana bimetallic) a me IEC 60694 no nā ʻāpana hoʻomalu wela.
- Mea Hana: Tankii Alloy Material, i hōʻoia ʻia i ka ISO 9001 a me ISO 14001, me ka ʻōwili ʻia ʻana o ka ʻāpana lahilahi a me ka hiki ke ʻoki pololei.
Nā Pōmaikaʻi Nui (vs. Generic Thin-Gauge Bimetallic Strips)
Kū ka P675R (0.16mm×27mm) no kāna hana kikoʻī kikoʻī a me ka maʻalahi o ka laulā paʻa.
- ʻO Ultra-Thin Stability: Mālama i ka mānoanoa like ʻole (0.16mm) a ʻaʻohe delamination interfacial - ʻoiai ma hope o 5000 thermal cycles (-40 ℃ a 180 ℃) - e hoʻonā i ka pilikia maʻamau o nā ʻāpana bimetallic thin-gauge (≤0.2mm) hiki ke hoʻokaʻawale ʻia a i ʻole ka hoʻokaʻawale papa.
- ʻO ka hoʻokō wela kūpono: 温曲率 i hoʻomalu ʻia (ka curvature i hoʻokomo ʻia i ka mahana) o 9-11 m⁻¹ (ma 100 ℃ vs. 25 ℃), me ka hoʻokaʻawale ʻana o ka wela ≤± 1.5 ℃—koʻikoʻi no nā mea paʻa (e laʻa, nā pahu pale wela haiki.
- ʻO ka laulā paʻa no ka hana ʻana: 27mm ākea maʻamau e pili ana i ka nui o ka micro-stamping die maʻamau, e hoʻopau ana i ka pono no ka slitting lua a me ka hōʻemi ʻana i ka ʻōpala waiwai e ≥15% i hoʻohālikelike ʻia me nā ʻāpana laula maʻamau.
- Maikaʻi Mīkini Maikaʻi: Hiki i ke anana lahilahi 0.16mm ke kulou maʻalahi (ka liʻiliʻi bending radius ≥2× mānoanoa) a me ka ʻoki ʻana i ka laser i loko o nā ʻano micro (e laʻa, nā mea hoʻopili thermostat liʻiliʻi) me ka ʻole o ka haki ʻana—kūpono me nā laina hui automated kiʻekiʻe.
- Kū'ē Kū'ē: Hāʻawi ka lapaʻau passivation ʻili i nā hola he 72-hola i ka paʻakai paʻakai (ASTM B117) me ka ʻulaʻula ʻole, kūpono no nā wahi haʻahaʻa (e laʻa, nā mea ʻike wela wela).
Nā Kūlana ʻenehana
| ʻAno | Waiwai (Maʻamau) |
| mānoanoa | 0.16mm (hoʻomanawanui: ±0.005mm) |
| Laulā | 27mm (hoʻomanawanui: ±0.1mm) |
| Ka lōʻihi no ka ʻōwili | 100m – 300m (ʻoki-i-lōʻihi loaʻa: ≥50mm) |
| Lakiō hoʻonui ʻana wela (Layer kiʻekiʻe/haʻahaʻa) | ~13.6:1 |
| Kaulana Mahana Hana | -70 ℃ a 350 ℃ |
| Hoʻoholo ʻia i ka wela o ka hana ʻana | 60 ℃ - 150 ℃ |
| Ikaika Shear Interfacial | ≥160 MPa |
| Ikaika U'i (Ku'a) | ≥480 MPa |
| Elongation (25 ℃) | ≥12% |
| Kū'ē (25 ℃) | 0.18 – 0.32 Ω·mm²/m |
| ʻO ʻAla ʻili (Ra) | ≤0.8μm (hoʻopau wili); ≤0.4μm (hoʻopau poli, koho) |
Nā Kūlana Huahana
| 'ikamu | Hōʻike |
| Hoʻopau ʻili | ʻO ka pau ʻana o ka wili palaoa (ʻoki ʻole) a i ʻole ka hoʻopau passivated (no ka pale ʻana i ka corrosion) |
| Palahalaha | ≤0.08mm/m (koʻikoʻi no ka pololei micro-stamping) |
| Ka maikaʻi o ka hoʻopaʻa ʻana | 100% ka hoʻopaʻa ʻana ma waena (ʻaʻohe voids> 0.05mm², hōʻoia ʻia ma o ka nānā ʻana i ka X-ray) |
| Solderability | ʻO ka pahu pahu koho (ka mānoanoa: 3-5μm) no ka hoʻonui ʻana i ka solderability me nā mea kūʻai aku Sn-Pb/lead-free. |
| Hoʻopili ʻia | Hoʻopaʻa ʻia ʻo Vacuum i nā ʻeke alumini anti-oxidation me nā desiccants; nā wili plastik (150mm anawaena) no ka pale ʻana i ka hoʻololi ʻana |
| Hoʻopilikino | Hoʻololi i ka wela o ka hana (30 ℃ - 200 ℃), ka uhi ʻana o ka ʻili (e laʻa me ka nickel-plating), a i ʻole nā ʻano i hoʻopaʻa mua ʻia (no nā faila CAD mea kūʻai aku) |
Nā noi maʻamau
- Nā Mana Māmā: Micro-thermostats no nā mea hiki ke hoʻohana (e laʻa, nā wati akamai), nā mea pono hale liʻiliʻi (e laʻa, nā mea kuke laiki liʻiliʻi), a me nā mea lapaʻau (e laʻa, nā mea hoʻoluʻu insulin).
- Paleʻa Wela Nui: ʻO nā mea hoʻokaʻawale kaapuni liʻiliʻi no nā ʻokoʻa lithium-ion (e laʻa, nā panakō mana, nā ʻoniʻoni pepeiao ʻole) a me nā kaʻa micro (e laʻa, nā kaʻa drone).
- ʻO ka uku pololei: ʻO nā shims e uku ana i ka wela no nā mea ʻike MEMS (e laʻa, nā mea ʻike kaomi i nā smartphones) e hoʻopau i nā hewa ana i hoʻonui ʻia i ka wela.
- Mea Hoʻohana Electronics: Nā mea hana wela no ka hoʻomalu ʻana i ke kukui hope o ka pona a me nā mea hoʻoponopono wela fuser paʻi.
- Nā Mea Hana ʻOihana: Nā hoʻololi wela liʻiliʻi no nā mea ʻike IoT (e laʻa, nā mea ʻike wela home / humidity sensor) a me nā ʻāpana micro kaʻa (e laʻa, nā mākaʻikaʻi ʻōnaehana wahie).
Hoʻopili ʻo Tankii Alloy Material i kēlā me kēia pūʻulu o nā ʻāpana bimetallic P675R (0.16mm×27mm) i ka hoʻāʻo ʻana i ka maikaʻi: nā hoʻāʻo ʻāwī paʻa interfacial, 1000-cycle thermal stability tests, ka nānā ʻana ma o ka laser micrometry, a me ka calibration wela o ka hana. Loaʻa nā laʻana manuahi (50mm×27mm) a me nā hōʻike kikoʻī o ka hana (me 温曲率 vs. nā pihi wela) ma ke noi. Hāʻawi kā mākou hui ʻenehana i ke kākoʻo i hoʻohālikelike ʻia—e like me ka hoʻoponopono ʻana i ka papa alloy no nā mahana hoʻokō kikoʻī a me nā alakaʻi kaʻina hana micro-stamping—e hōʻoia i ka hoʻokō ʻana o ka strip i nā pono kikoʻī o nā noi paʻa a pololei.
Mua: 24AWG 36AWG Uea Kūʻē Manganin 6j12 no ka Mea Pono Aʻe: Kiʻekiʻe wela enameled manganese uea keleawe