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0.16mm x 27mm P675R/TM2/TB20110 ʻĀpana Bimetallic ASTM B388 Pane Wela wikiwiki a me ke kūpaʻa
Wehewehe Huahana
ʻĀpana Bimetallic P675R (Mānoanoa 0.16mm × Laulā 27mm)
ʻIke Huahana
ʻO ke kaha bimetallic P675R (0.16mm × 27mm), kahi mea hana i hana ʻia me ka pololei mai Tankii Alloy Material, he kaha composite kūikawā i haku ʻia me ʻelua mau alloys like ʻole me nā coefficients hoʻonui thermal ʻokoʻa—i hoʻopaʻa paʻa ʻia ma o kā mākou ʻenehana hoʻopili wela a me ka diffusion. Me kahi ana lahilahi paʻa o 0.16mm a me ka laulā maʻamau o 27mm, ua hoʻonohonoho pono ʻia kēia kaha no nā noi hoʻopili mahana miniaturized, kahi e koʻikoʻi ai ka actuation thermal pololei, ka dimensionality paʻa, a me ka hoʻolālā mālama wahi. Ma ka hoʻohana ʻana i ka ʻike loea o Huona i ka hana composite bimetallic, hāʻawi ka papa P675R i ka hana deformation i hoʻokele ʻia e ka mahana, e ʻoi aku ka maikaʻi ma mua o nā kaha bimetallic generic i ka hoʻohālikelike micro-device a me ke kūpaʻa luhi lōʻihi—e kūpono ana no nā thermostats compact, nā mea pale wela, a me nā ʻāpana uku mahana pololei.
Nā Hoʻonohonoho Maʻamau a me ka Hoʻonohonoho Koʻikoʻi
- Papa Huahana: P675R
- Kikoʻī Ana: mānoanoa 0.16mm (ʻae ʻia: ±0.005mm) × laulā 27mm (ʻae ʻia: ±0.1mm)
- ʻAno Hui: ʻO ka maʻamau, he "papa hoʻonui kiʻekiʻe" a me kahi "papa hoʻonui haʻahaʻa", me ka ikaika ʻoki interfacial ≥160 MPa
- Nā Kūlana Kūlike: Pili i ka GB/T 14985-2017 (ke kūlana Kina no nā ʻāpana bimetallic) a me IEC 60694 no nā ʻāpana kaohi wela
- Mea Hana: Tankii Alloy Material, i hōʻoia ʻia e ISO 9001 a me ISO 14001, me nā hiki ke ʻōwili a me ka ʻoki pololei i loko o ka hale.
Nā Pōmaikaʻi Koʻikoʻi (vs. Generic Thin-Gauge Bimetallic Strips)
ʻO ke kaha P675R (0.16mm × 27mm) e kū nei no kāna hana kikoʻī lahilahi a me ka maʻalahi o ka laulā paʻa:
- Paʻa Lahilahi Loa: Mālama i ka mānoanoa like (0.16mm) a ʻaʻohe delamination interfacial—ʻoiai ma hope o 5000 mau pōʻaiapuni thermal (-40℃ a 180℃)—e hoʻoponopono ana i ka pilikia maʻamau o nā ʻāpana bimetallic lahilahi (≤0.2mm) e maʻalahi ana i ka warping a i ʻole ka hoʻokaʻawale ʻana o ka papa.
- Hoʻoikaika Wela Pololei: 温曲率 i kāohi ʻia (curvature i hoʻoulu ʻia e ka mahana) o 9-11 m⁻¹ (ma 100℃ vs. 25℃), me ka ʻokoʻa mahana hoʻoikaika ≤±1.5℃—koʻikoʻi no nā mea liʻiliʻi (e laʻa me nā mea pale wela micro-battery) kahi e haiki ai nā paepae mahana.
- Ka laulā paʻa no ka hana ʻakomi: Hoʻohālikelike ka laulā maʻamau 27mm i nā nui make micro-stamping maʻamau, e hoʻopau ana i ka pono no ka ʻoki lua a me ka hōʻemi ʻana i ka ʻōpala mea ma ≥15% i hoʻohālikelike ʻia me nā ʻāpana laulā maʻamau.
- Maikaʻi ka mīkini: ʻO ke ana lahilahi 0.16mm e hiki ai ke kulou maʻalahi (ka radius kulou liʻiliʻi ≥2 × ka mānoanoa) a me ka ʻoki ʻana i ka laser i nā ʻano liʻiliʻi (e like me nā pilina thermostat liʻiliʻi) me ka ʻole o ka haki ʻana—kūpono me nā laina hōʻuluʻulu wikiwiki kiʻekiʻe.
- Ke Kū'ē ʻana i ka ʻAi ʻAna: Hāʻawi ka mālama ʻana i ka passivation ʻili koho i ke kū'ē ʻana i ka pīpī paʻakai no 72 hola (ASTM B117) me ka ʻole o ka popo ʻulaʻula, kūpono no nā wahi pulu (e like me nā mea ʻike mahana o nā hāmeʻa hiki ke komo).
Nā Kikoʻī ʻenehana
| ʻAno | Waiwai (Maʻamau) |
|---|---|
| Mānoanoa | 0.16mm (hoʻomanawanui: ±0.005mm) |
| Ka laulā | 27mm (hoʻomanawanui: ±0.1mm) |
| Ka lōʻihi no kēlā me kēia ʻōwili | 100m – 300m (loaʻa ka ʻoki-i-ka-lōʻihi: ≥50mm) |
| Ka Lākiō Hoʻonui Wela (Papa Kiʻekiʻe/Haʻahaʻa) | ~13.6:1 |
| Pae Mahana Hana | -70℃ a i 350℃ |
| Pae Mahana Hana i helu ʻia | 60 ℃ - 150 ℃ (hiki ke hoʻopilikino ʻia ma o ka hoʻoponopono ʻana i ka lakio alloy) |
| Ikaika ʻokiʻoki Interfacial | ≥160 MPa |
| Ikaika Uila (Transverse) | ≥480 MPa |
| Elongation (25 ℃) | ≥12% |
| Ke kū'ē (25 ℃) | 0.18 – 0.32 Ω·mm²/m |
| ʻO ka ʻOʻoleʻa o ka ʻIli (Ra) | ≤0.8μm (hoʻopau wili); ≤0.4μm (hoʻopau wili ʻia, koho) |
Nā kikoʻī huahana
| Mea | Nā kikoʻī |
|---|---|
| Hoʻopau ʻili | Hoʻopau wili (ʻaʻohe oxide) a i ʻole ka hoʻopau passivated (no ke kūpaʻa ʻana i ka corrosion) |
| Palahalaha | ≤0.08mm/m (koʻikoʻi no ka pololei o ka micro-stamping) |
| Ka maikaʻi o ka hoʻopaʻa ʻana | 100% ka hoʻopaʻa ʻana o ka interfacial (ʻaʻohe hakahaka >0.05mm², i hōʻoia ʻia ma o ka nānā ʻana o X-ray) |
| Ka hiki ke hoʻopaʻa ʻia | ʻO ke koho tin-plating (mānoanoa: 3-5μm) no ka hoʻonui ʻia ʻana o ka solderability me Sn-Pb/lead-free solders |
| Ka hoʻopili ʻana | Hoʻopaʻa ʻia i loko o nā ʻeke pepa alumini anti-oxidation me nā desiccants i hoʻopaʻa ʻia i loko o ka vacuum; nā spools plastik (150mm ke anawaena) e pale aku i ka deformation strip |
| Hoʻopilikino ʻana | Hoʻoponopono ʻana i ka mahana hana (30 ℃ - 200 ℃), ka uhi ʻana i ka ʻili (e laʻa, ka nickel-plating), a i ʻole nā kikona i hoʻopaʻa mua ʻia (no kēlā me kēia faila CAD o ka mea kūʻai aku) |
Nā Hoʻohana Maʻamau
- Nā Mana Hoʻomalu Mahana Liʻiliʻi: Nā micro-thermostat no nā mea hiki ke komo (e like me nā uaki akamai), nā lako hale liʻiliʻi (e like me nā mea kuke laiki mini), a me nā mea lapaʻau (e like me nā mea hoʻoluʻolu insulin).
- Palekana i ka Wela Loa: Nā mea haki kaapuni liʻiliʻi no nā pila lithium-ion (e like me nā panakō mana, nā pila pepeiao uea ʻole) a me nā micro-motors (e like me nā motika drone).
- Uku Kūpono: Nā shim e hoʻoponopono ana i ka mahana no nā mea ʻike MEMS (e laʻa, nā mea ʻike kaomi i loko o nā kelepona akamai) e hoʻoponopono i nā hewa ana i hoʻoulu ʻia e ka hoʻonui wela.
- Nā Uila Mea kūʻai aku: Nā mea hoʻoikaika wela no nā kaohi kukui o ka papapihi kamepiula lawe lima a me nā mea hoʻoponopono mahana fuser o ka mīkini paʻi.
- Nā Hana Liʻiliʻi ʻOihana: Nā kuapo wela liʻiliʻi no nā mea ʻike IoT (e laʻa, nā mea ʻike mahana/haʻahaʻa o ka home akamai) a me nā ʻāpana liʻiliʻi kaʻa (e laʻa, nā mea nānā mahana o ka ʻōnaehana wahie).
Hoʻāʻo pono ʻia kēlā me kēia pūʻulu o nā ʻāpana bimetallic P675R (0.16mm × 27mm) e Tankii Alloy Material: nā hoʻāʻo ʻokiʻoki interfacial bonding, nā hoʻāʻo kūpaʻa wela 1000-cycle, ka nānā ʻana i nā dimensional ma o ka micrometry laser, a me ka hoʻoponopono ʻana i ka mahana actuation. Loaʻa nā laʻana manuahi (50mm × 27mm) a me nā hōʻike hana kikoʻī (me nā piʻo 温曲率 vs. mahana) ma ke noi. Hāʻawi kā mākou hui loea i ke kākoʻo i hana kūikawā ʻia—e like me ka hoʻonui ʻana i ka papa alloy no nā mahana actuation kikoʻī a me nā alakaʻi hana micro-stamping—e hōʻoia i ka hoʻokō ʻana o ke kaha i nā pono kikoʻī o nā noi compact, precision-driven.
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