ʻO nā mea hana brazing nui ʻo AgCu7.5, AgCu25, AgCu28,ʻAgCu55, a pēlā aku, a hoʻohana nui ʻia ka AgCu28. Loaʻa iā lākou ka conductivity maikaʻi, ka fluidity a me ka wettability, a hoʻohana nui ʻia i ka ʻoihana vacuum uila. Ma muli o ke kūpaʻa haʻahaʻa i ka ukana lōʻihi ma lalo o ke ana wela kiʻekiʻe, kūpono wale nō ia no nā ʻāpana brazing nona ka mahana hana i haʻahaʻa ma mua o 400ºC.
Hoʻohana ʻia e like me nā ʻāpana kālā a me nā mea hoʻonaninani. ʻO nā mea hoʻohui i hoʻohana ʻia e like me nā ʻāpana kālā ʻo AgCu7.5, AgCu8,ʻAgCu10, a pēlā aku; ʻo nā mea hoʻohui i hoʻohana ʻia ma ke ʻano he mea hoʻonaninani ʻo AgCu8.4, AgCu12.5, a pēlā aku
| Ag | Cu | Sn | Ni | Pb | Fe | Sb | Bi | |
| ʻAgCu4 | 96+/-0.3 | 4+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
| ʻAgCu5 | 95+/-0.3 | 5+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
| ʻAgCu7.5 | 92.5+/-0.3 | 7.5+0.3/-0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
| ʻAgCu8.4 | 91.6+/-0.3 | 8.4+/-0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
| ʻAgCu10 | 90+/-0.3 | 10+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| ʻAgCu12.5 | 87.5+/-0.3 | 12.5+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| ʻAgCu20 | 80+/-0.3 | 20+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| ʻAgCu23 | 77+/-0.5 | 23+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| ʻAgCu25 | 75+/-0.5 | 25+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| ʻAgCu26 | 74+/-0.5 | 26+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| ʻAgCu28 | 72+/-0.5 | 28+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| ʻAgCu50 | 50+/-0.5 | 50+/-0.5 | ≤0.005 | ≤0.25 | ≤0.002 | ≤0.002 | ||
| ʻAgCu99 | 1+/-0.2 | 99+0.2/-0.5 | ||||||
| ʻAgCu18Ni2 | 80+/-0.5 | 18+/-0.5 | / | 2+/-0.3 |
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