ʻO BR1 Thermostatic Bimetal alloy strip
(Inoa maʻamau: Truflex P675R, Chace 7500, Telcon200, Kan-thal 1200)
Paʻa ka Bimetallic TB208/110 i ka ʻike wela kiʻekiʻe a me ka resistivity kiʻekiʻe, akā ʻoi aku ka haʻahaʻa o ka modulus o ka elasticity a me ke kaumaha ʻae ʻia, hiki iā ia ke hoʻomaikaʻi i ka naʻau o ka mea kani, hoʻemi i ka nui a hoʻonui i ka ikaika.
Thermal bimetal strip mea e ka okoa hoonui coefficient o elua a oi ma mua o elua papa o ka metala a metala paʻa hui, a me ka holoʻokoʻa interface like 'ole me ka mahana a me ka thermal hana o ka hoʻololi 'ano i composite materials. o ka papa waena ma ke ʻano he shunt layer, ʻo ia ke hoʻokō i ke kumu o ka mālama ʻana i nā resistivity ʻokoʻa.
Ke hoʻololi nei ke ʻano kumu o ka bimetal thermal me ka hoʻololi ʻana o ka mahana a me ka wela, ka hopena i kekahi manawa.
Huina
| Papa | BR1 |
| Papa hoʻonui kiʻekiʻe | Mn75Ni15Cu10 |
| Papa hoʻonui haʻahaʻa | Ni36 |
ʻO ka hui kemika(%)
| Papa | C | Si | Mn | P | S | Ni | Cr | Cu | Fe |
| Ni36 | ≤0.05 | ≤0.3 | ≤0.6 | ≤0.02 | ≤0.02 | 35~37 | - | - | ʻO Bal. |
| Papa | C | Si | Mn | P | S | Ni | Cr | Cu | Fe |
| Mn75Ni15Cu10 | ≤0.05 | ≤0.5 | ʻO Bal. | ≤0.02 | ≤0.02 | 14-16 | - | 9~11 | ≤0.8 |
Nā waiwai kino maʻamau
| ʻO ka mānoanoa (g/cm3) | 7.7 |
| Hiki ke pale i ka uila ma 20ºC (ohm mm2/m) | 1.13 ±5% |
| Ka hoʻoili wela, λ/ W/(m*ºC) | 6 |
| Elastic Modulus, E/ Gpa | 113~142 |
| Piʻo K / 10-6 ºC-1(20~135ºC) | 20.8 |
| Ka piʻo ʻana o ka wela F/(20~130ºC)10-6ºC-1 | 39.0%±5% |
| ʻAe wela (ºC) | -70~ 200 |
| Ka wela laina (ºC) | -20~ 150 |
Noi: Hoʻohana nui ʻia ka mea e like me ka non magnetic non-matching ceramic sealing material ma Gyro a me nā mea uila uila ʻē aʻe.
150 0000 2421