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Papa keleawe CuMn3 Manganin 1.0mm × 300mm × 1000mm Papa Alloy Conductivity kiʻekiʻe

Wehewehe Pōkole:


  • Papa Alloy:CuMn3 (hoʻomehana annealed, M)
  • Nā Ana:1.0 × 300 × 1000mm (hiki ke hoʻopilikino ʻia)
  • 1.0 × 300 × 1000mm (hiki ke hoʻopilikino ʻia):0.18 μΩ·m
  • TCR (0–100℃):±5×10⁻⁶/℃
  • Ikaika Hoʻopaʻa:≥280 MPa (annealed)
  • Hoʻolōʻihi:≥35%
  • Paʻakikī (HB):60–80
  • Ka nui o ka paʻa:8.90 g/cm³
  • Nā kikoʻī huahana

    Nā nīnau i nīnau pinepine ʻia

    Nā Lepili Huahana

    Wehewehe Huahana

    CuMn3Papa Keleawe Manganin(1.0 × 300 × 1000mm)

    ʻIke Huahana

    ʻO ka papa keleawe CuMn3 manganin (1.0 × 300 × 1000mm) mai Tankii Alloy Material he papa keleawe-manganese kiʻekiʻe me kahi ʻili ʻālohilohi a laumania e like me ka mea i hōʻike ʻia. Hana ʻia me Cu (kaulike) + 2.5–3.5% Mn me nā mea hoʻopaʻa trace, hana ʻia ia ma o ka hoʻoheheʻe ʻana i ka vacuum, ka ʻōwili wela/anuanu, ka annealing pololei, a me ka polishing ʻili. Loaʻa iā ia ke coefficient wela haʻahaʻa loa o ke kū'ē (TCR), ka resistivity paʻa, a me ke ʻano maikaʻi loa, e kūpono ana no nā resistors pololei, nā shunt o kēia manawa, nā ana strain, a me nā ʻāpana uila e pono ai ke kūpaʻa lōʻihi.

    Nā Hoʻonohonoho Maʻamau a me ke Kumu Mea Koʻikoʻi

    • Papa Alloy: CuMn3 (like me UNS C18700, DIN 2.0842, GB/T 2040-2017)
    • Kikoʻī Koʻikoʻi: 1.0mm (mānoanoa) × 300mm (ākea) × 1000mm (lōʻihi); ke ahonui: mānoanoa ±0.02mm, laulā ±0.3mm, lōʻihi ±2mm
    • Ka Hoʻohui Kemika (wt%): Mn: 2.5–3.5%; Cu: kaulike; Fe ≤0.3%; Pb ≤0.05%; C ≤0.1%
    • Nā Kūlana Kūlike: ASTM B124, EN 13602, GB/T 2040-2017, RoHS 2.0
    • Mea Hana: Tankii Alloy Material, i hōʻoia ʻia e ISO 9001 a me ISO 14001

    Nā Pōmaikaʻi Koʻikoʻi (Kūlana ma ka Hoʻopau ʻĀlohilohi a me ka Papa 1.0mm)

    1. Hana Uila Paʻa Loa

    • TCR Haʻahaʻa a me ke Kūʻē Paʻa: Kūʻē = 0.18 μΩ·m (20℃), TCR = ±5×10⁻⁶/℃ (0–100℃), e hōʻoiaʻiʻo ana i ka holo ʻana o ke kūʻē ≤0.005%/℃—koʻikoʻi no ke ana pololei ʻana a me nā kaapuni kaohi.
    • ʻIli ʻĀlohilohi a me ke Kūʻē Hoʻokaʻaʻike Haʻahaʻa: ʻO ka hoʻopau ʻālohilohi i hoʻopili ʻia (Ra ≤0.2μm) e hōʻemi i ke kūʻē hoʻokaʻaʻike a hoʻomaikaʻi i ka solderability, kūpono no nā shunt a me nā blanks resistor.

    2. Nā Waiwai Mekanika a me ka Hana Hana Maikaʻi Loa

    • Maikaʻi ka Ductility a me ke ʻano: Elongation ≥35% (annealed), radius kūlou ≤1 × mānoanoa (180° kūlou me ka ʻole o ka haki ʻana), kākoʻo i ka stamping, etching, a me ka ʻoki laser.
    • ʻO ke kiʻekiʻe o ka pālahalaha a me ka pololei o ke ana: ʻO ka pālahalaha ≤0.1mm/m, ʻano like o ka mānoanoa ±0.02mm, kūpono no ka hoʻopau ʻana i nā ʻāpana kikoʻī kiʻekiʻe.

    3. Maikaʻi ka ʻino a me ke kūpaʻa kaiapuni

    • Ke Kū'ē ʻAna i ka Lewa a me ka ʻAʻole Paʻakikī: Hoʻokumu i kahi ʻili oxide mānoanoa, hala i ka hoʻāʻo pīpī paʻakai ASTM B117 500-hola me ka ʻike ʻole ʻia o ka pala.
    • Mahana Hana Laulā: -40℃ a i 120℃, hana paʻa i nā wahi hana ʻoihana a me nā lako uila.

    Nā Kikoʻī ʻenehana

    ʻAno Waiwai (Maʻamau)
    Papa Alloy CuMn3 (hoʻomehana annealed, M)
    Nā Ana 1.0 × 300 × 1000mm (hiki ke hoʻopilikino ʻia)
    Ke kū'ē (20 ℃) 0.18 μΩ·m
    TCR (0–100℃) ±5×10⁻⁶/℃
    Ikaika Hoʻopaʻa ≥280 MPa (annealed)
    Hoʻolōʻihi ≥35%
    Paʻakikī (HB) 60–80
    Ka nui o ka paʻa 8.90 g/cm³
    Hoʻopau ʻili ʻĀlohilohi i hoʻopili ʻia (Ra ≤0.2μm)
    Mahana Hana -40℃ a i 120℃

    Nā kikoʻī huahana

    Mea Nā kikoʻī
    Palapala Hoʻolako Pā hoʻokahi / puʻu (10–50 mau pā no kēlā me kēia puʻu)
    Ka mālama ʻana i ka ʻili ʻĀlohilohi i hoʻowali ʻia, i hoʻopaʻakai ʻia, a i ʻole i hoʻokomo ʻia i loko o ka pahu uila (koho)
    Ka hiki ke hana Ke kahakaha ʻana, ke kālai ʻana, ka ʻoki ʻana i ka laser, ka mīkini CNC, ka wili kiko
    Ka hoʻopili ʻana ʻO ka kiʻiʻoniʻoni PE + hua interlayer + pahu lāʻau (anti-scratch & deformation)
    Hoʻopilikino ʻana Mānoanoa (0.5–20mm); laulā (100–1000mm); lōʻihi (500–3000mm); hoʻoponopono paʻakikī

    Nā hiʻohiʻona noi maʻamau

    • Nā Mea Hana Pololei: Nā pale pale pololei, nā shunt o ke au, nā alahaka Wheatstone no nā multimeter a me nā mea kālailai mana.
    • Nā ʻĀpana Uila: Nā hakahaka anakahi hoʻokano, nā makau kū'ē no nā mea hoʻololi alapine, nā kaapuni hoʻoponopono mahana.
    • Mana ʻOihana: Nā modula hoʻoponopono hōʻailona, ​​​​nā mea pale kū'ē pololei PLC.
    • Lapaʻau a me ke kaʻa: Nā mea pale o nā lako hana diagnostic lawe lima, nā shunt sensor kaʻa.

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