Kaulike:
ʻO ka braper crepit haʻahaʻa haʻahaʻa,ʻo ka paleʻana o ka matload, nā meaʻala wela, nā pale uila uila
Thancecture | Kaohi (200c μω.m) | Max.working wela (0c) | Ikaika ikaika (MPA) | Melting Point (0c) | Density (g / cm3) | TCR X10-6 / 0C (20 ~ 600 0C) | Hana Emf vs Cu (μv / 0c) (0 ~ 100 0C) |
Alloy nonemenclare | |||||||
Nc005 (cuni2) | Poloka uila- | 200 | ≥220 | 1090 | 8.9 | <120 | -12 |
Copipono Bilkerl Aly- Cuni2
Nā mea kanu lāʻau,%
Ni | Mn | Fe | Si | Cu | MAKAU NOIA | Kuhikuhi kuhikuhi | |||
Cd | Pb | Hg | Cr | ||||||
2 | - | - | - | Bal | - | ND | ND | ND | ND |
Nā Pīkuhi Propertinies
ʻO ka lawelaweʻo Max hoʻomau | 200ºCHCEC |
Ke kipi i ka 20ºC | 0,05 ± 10% ohm mm2 / M |
Huakai | 8.9 g / cm3 |
Ka HōʻaʻO Kokua | <120 |
Malting Point | 1090ºC |
ʻO ka ikaika ikaika,ʻo N / MM2 Anne i hoʻopaʻaʻia, palupalu | 140 ~ 310 mpa |
ʻO ka ikaika o ka ikaika, N / mm2 maloʻo | 280 ~ 620 mpa |
Elongation (anneal) | 25% (min) |
Elongation ('ōwili maloʻo) | 2% (min) |
EmF vs Cu, μV / ºc (0 ~ 100ºC) | -12 |
ʻO ka hoʻolālā micrographic | Austente |
Waiwai magnetic | Non |