| ʻO ke kinikini | Ni% | Mn% | Fe% | Si% | Cu% | C% | S% |
| Nikala 201 | 99 liʻiliʻi loa | Max 0.35 | Max 0.4 | Max 0.35 | Max 0.25 | Max 0.02 | Max 0.01 |
ʻIkepili Kino
| Ka nui o ka paʻa | 8.9g/cm3 |
| Wela Kūikawā | 0.109(456 J/kg.ºC) |
| Ke kū'ē uila | 0.085×10-6ohm.m |
| Kiko Heheʻe | 1435-1445ºC |
| Ka Hoʻokele Wela | 79.3 W/mK |
| Hoʻonui Wela Coeff Maʻamau | 13.1 × 10-6m/m.ºC |
Nā Waiwai Mekanika Maʻamau
| Nā Waiwai Mekanika | Nikala 201 |
| Ikaika Hoʻopaʻa | 403 Mpa |
| Ikaika Hāʻawi | 103 Mpa |
| Hoʻolōʻihi | 50% |
ʻO kā mākou kūlana hana
| Pā | Ke kāhiko ʻana | Paipu | Pepa/ʻĀpana | Uea | |
| ASTM | ASTM B160 | ASTM B564 | ASTM B161/B163/B725/B751 | ʻAMS B162 | ASTM B166 |
MaʻemaʻeUea Nikala
1.>ʻoi aku ka ikaika a me nā ʻano resistivity haʻahaʻa i ke kūlana o ka mahana kiʻekiʻe.
2.>ʻAno: palupalu; paʻakikī; 1/2 paʻakikī
3.>Ka pōʻaiapuni hana: 3-7 lā
4.>Moʻo o ka uea nikala maʻemaʻe: uea nikala 200, uea nikala 201.
5.>Hiki ke hiki i ka maʻemaʻe a hiki i ka 99.99%, hiki ke hiki i ka lahilahi loa a hiki i ka 0.02mm
Nā hiʻohiʻona
1.>Me ka solderability, conductivity kiʻekiʻe, coefficient hoʻonui linear kūpono
2.> Ikaika maikaʻi, kū'ē haʻahaʻa i ka mahana kiʻekiʻe
3.>Kiʻekiʻe ke kiko heheʻe, kūpaʻa i ka pala, nā waiwai mechanical maikaʻi, i ke kūlana wela a me ke anu he hana kaomi maikaʻi aʻe, maʻalahi ke degassing, no ka lekiō, kukui uila, hana mīkini, ʻoihana kemika, nā mea uila vacuum he mea nui ia o nā mea kūkulu.

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