Hoʻohana ʻia e like me nā mea brazing nui ʻo AgCu7.5,AgCu25, AgCu28, AgCu55, a me nā mea'ē aʻe, a hoʻohana nuiʻia ka AgCu28. Loaʻa iā lākou ka conductivity maikaʻi, fluidity a me ka wettability, a ua hoʻohana nuiʻia i kaʻoihana uila. Ma muli o ka haʻahaʻa haʻahaʻa i ka ukana lōʻihi ma lalo o ka wela kiʻekiʻe, kūpono wale ia no nā ʻāpana brazing nona ka mahana hana ma lalo o 400ºC.
Hoʻohana ʻia e like me nā kālā a me nā mea hoʻonaninani. ʻO nā huila i hoʻohana ʻia e like me nā ʻāpana kālā ʻo AgCu7.5, AgCu8,AgCu10, etc.; ʻO nā mea i hoʻohana ʻia e like me nā mea hoʻonaninani ʻo AgCu8.4, AgCu12.5, etc
Ag | Cu | Sn | Ni | Pb | Fe | Sb | Bi | |
AgCu4 | 96+/-0.3 | 4+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
AgCu5 | 95+/-0.3 | 5+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
AgCu7.5 | 92.5+/-0.3 | 7.5+0.3/-0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
AgCu8.4 | 91.6+/-0.3 | 8.4+/-0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
AgCu10 | 90+/-0.3 | 10+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu12.5 | 87.5+/-0.3 | 12.5+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu20 | 80+/-0.3 | 20+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu23 | 77+/-0.5 | 23+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu25 | 75+/-0.5 | 25+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu26 | 74+/-0.5 | 26+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu28 | 72+/-0.5 | 28+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu50 | 50+/-0.5 | 50+/-0.5 | ≤0.005 | ≤0.25 | ≤0.002 | ≤0.002 | ||
AgCu99 | 1+/-0.2 | 99+0.2/-0.5 | ||||||
AgCu18Ni2 | 80+/-0.5 | 18+/-0.5 | / | 2+/-0.3 |