ʻO ka ʻāpana huila manganin 6J13 (0.19mm × 25mm), kahi huahana huila pale i hana ʻia me ka pololei mai Tankii Alloy Material, he ʻāpana hana lahilahi i hana ʻia mai ka huila manganin ternary Mn-Cu-Ni. Ma o ka hoʻoheheʻe ʻana i ka vacuum holomua, ka ʻōwili anu pololei multi-pass, a me nā kaʻina hana annealing segmented, hoʻokō kēia ʻāpana i ka mana dimensional paʻa loa (0.19mm ka mānoanoa ± 0.002mm, 25mm ka laulā ± 0.1mm) a me nā waiwai uila kūlike.

• Papa Alloy: 6J13 (metala kū'ē pololei manganin maʻamau Kina; i hoʻonohonoho pono ʻia no ka hana ʻōwili lahilahi)
• Kikoʻī Ana: 0.19mm ka mānoanoa × 25mm ka laulā (hiki ke hoʻopilikino ʻia, akā kūlike kēia 规格 paʻa i nā make stamping micro-component mainstream)
• Hoʻonohonoho Honua: Hana i hoʻohālikelike ʻia me nā ʻāpana lahilahi DIN 17471 CuMn12Ni2, me ka nui o ka Mn i hoʻoponopono ʻia (12.0-13.0%) e hoʻonui i ka ductility lahilahi
• Nā Kūlana Kūlike: GB/T 1234-2019 (nā ʻāpana hao kū'ē) + GB/T 2059-2021 (nā ʻāpana hao keleawe) + IEC 60404-8-2 (nā ʻāpana kū'ē pololei)
• Mea Hana: Tankii Alloy Material, i hōʻoia ʻia e ISO 9001 a me RoHS, me nā laina ʻōwili alloy lahilahi kūikawā (mānoanoa ʻōwili liʻiliʻi loa 0.01mm)

• ʻO ka Mānoanoa Pololei no ka Hoʻonui ʻana: Hoʻokō ka mānoanoa 0.19mm i ke "kaulike gula" no nā micro-devices - ʻoi aku ka lahilahi ma mua o nā ʻāpana 0.25mm (e hōʻemi ana i ka nui o ka ʻāpana ma 24%) me ka pale ʻana i ka palupalu o nā ʻāpana lahilahi loa (<0.15mm) e nahā ana i ka wā e hehi ai.
• Ka laulā haiki no ka Batch Stamping: Hoʻohālikelike ka laulā 25mm i 4-6 mau seti o nā micro-shunt stamping dies (ʻo kēlā me kēia die nui ~4mm) no kēlā me kēia ʻāpana, e hiki ai ke hoʻopaʻa ʻia i hoʻokahi manawa o 2000+ micro-components no kēlā me kēia 100m ʻāpana - e hōʻemi ana i ka ʻōpala mea ma 30% vs. ka hoʻohana ʻana i nā ʻāpana 50mm ākea no nā ʻāpana liʻiliʻi.

• ʻO ke kālai ʻia ʻana he maikaʻi loa: ʻO ke ʻano like o ke kaha (ka nui o ka palaoa ≤20μm) a me ka ʻili annealed ʻālohilohi (Ra ≤0.15μm) e kākoʻo i ke kālai kemika maikaʻi loa - ka laulā laina i kālai ʻia a hiki i ka 0.02mm.
• Paʻa ka Paʻa o ka Paʻa ʻana: Ma hope o 5000 mau manawa o ka paʻi mau ʻana (e hoʻohālike ana i ka hana nui ʻana), ʻo ka ʻokoʻa o ka mānoanoa o ke kaha he <0.001mm, a ʻo ke kū'ē ʻana o nā ʻāpana i paʻi ʻia he ≤0.05%.

• Hoʻolālā Mālama Mea: ʻO ka laulā haiki paʻa 25mm e hoʻopau i ka ʻoki lua (kahi hana maʻamau no nā ʻāpana ākea), e hōʻemi ana i nā kumukūʻai hana ma 18% a hoʻopōkole i nā pōʻaiapuni hoʻouna ma 3-5 mau lā.
• Koho ʻia ka mahana pālua: Hāʻawi i nā mahana palupalu (annealed, elongation ≥25%) a me ka hapalua-paʻakikī (elongation 15-20%) no nā kaʻina hana like ʻole.

• Hoʻouka wikiwiki ʻana i nā mea uila mea kūʻai: Nā shunts micro-current no nā mea hoʻoili kelepona 65W (kūpono ka mānoanoa o 0.19mm i ka hoʻolālā lahilahi o ka mea hoʻoili, kākoʻo ka laulā 25mm i ka stamping batch o 4 shunts no kēlā me kēia kaha).
• Nā Mea ʻIke Ola Hiki ke Hoʻokomo ʻia: Nā ʻāpana kūʻē no nā mea ʻike helu puʻuwai o ka uaki akamai (hiki i ka palupalu ke kūlou ʻana i ka radius 0.38mm, ʻo ka laulā haiki 25mm e hōʻemi ana i ka ʻōpala mea).
• Nā Pūnaehana Sensor IoT: Nā pūnaewele micro-resistor no nā mea ʻike mahana/haʻahaʻa uea ʻole (kākoʻo ka etchability ultra-fine i ka laulā laina 0.02mm).
• Nā Micro-Electronics Automotive: Nā ʻāpana ʻike au no nā modula hoʻouka USB i loko o ke kaʻa (ʻo ka hapalua-paʻakikī ka mea e hōʻoia i ka pololei o ka hoʻopaʻa ʻana o nā kiko pili).

Hoʻokō ʻo Tankii Alloy Material i ka "micro-precision quality control" no nā ʻāpana 6J13 (0.19 × 25mm): e ana ʻia ka mānoanoa o kēlā me kēia ʻōwili (100 mau kiko laʻana/m), ka nānā ʻana i ka ʻilikai (no kēlā me kēia ʻāpana 5m), a me ka hoʻāʻo hoʻohālike micro-stamping (100 mau laʻana no kēlā me kēia pūʻulu). Loaʻa nā laʻana manuahi (100mm × 25mm, koho ʻia ka palupalu/hapa-paʻakikī) a me nā hōʻike hoʻāʻo micro-etching ma ke noi.