Welina mai i kā mākou mau pūnaewele!
ʻO Tankii 1.0mm Uea Copper Tinned T2 ʻulaʻula Copper Anti-Oxidation a me ka hana maikaʻi loa.
Hōʻike huahana
1.0mm Uea keleawe i hoʻopaʻa ʻia (Pure Red Copper Core, 3-5μ Tin Coating)
Nānā Huahana
E like me ke kiʻekiʻe-reliability uila conductor mai Tankii Alloy Material, ka1.0mm uwea keleawe tinnedhoʻohui i ʻelua mau pōmaikaʻi nui: ʻo ke koʻikoʻi kiʻekiʻe o ke keleawe ʻulaʻula maʻemaʻe (T2 grade) a me ka pale anti-corrosion o kahi 3-5μ tin coating. Hana ʻia ma ke kaʻina hana hoʻoheheʻe wela hoʻomau a Huona—i hoʻolako ʻia me ka nānā ʻana i ka mānoanoa maoli a me ka hoʻomalu ʻana i ka wela—ʻo ka uea e hōʻoiaʻiʻo i ka paʻa like ʻana o ka papa tin i ke kumu keleawe paʻa 1.0mm, ʻaʻohe lua a i ʻole kiko lahilahi. Hoʻoponopono ia i ʻelua mau wahi ʻeha nui o ka uea keleawe ʻole: ka emi ʻana o ka conductivity oxidation a me ka maikaʻi ʻole o ka solderability, e lilo ia i mea nui no nā pili uila e koi ana i ka paʻa lōʻihi, ka hui maʻalahi, a me ke kūʻē ʻana i nā wahi haʻahaʻa / ʻoihana.
Palapala Kūlana a me nā mea waiwai
- Papa alakaʻi: T2 ke keleawe ʻulaʻula maʻemaʻe (kūpono me GB/T 3956-2008; like me ASTM B33, IEC 60288 Papa 1)
- Kūlana hoʻopaʻa kino: GB/T 4910-2009, IEC 60317-2 (lead-free: Pb ≤0.005%, Sn ≥99.9%)
- Nā Palapala Hoʻomaikaʻi: Hoʻokō ʻo RoHS 2.0, ʻōnaehana hoʻokele maikaʻi ISO 9001, ʻae ʻia ʻo SGS kaiapuni
- Mea hana: Tankii Alloy Material (15+ mau makahiki o ka ʻike hana hoʻokele keleawe)
Nā Pōmaikaʻi Hana Nui
1. Maʻemaʻe Red Copper Conductor: Unmatched Conductivity
- Hoʻolima Uila: ≥98% IACS (20 ℃), ʻoi aku ma mua o ke keleawe i hoʻohui ʻia (e laʻa, CuNi alloys: ~20% IACS) a me ka alumini (61% IACS). E hōʻoia i ka hāʻule liʻiliʻi o ka voltage ma nā kaʻa kaʻa haʻahaʻa (e laʻa, 12V uwila kaʻa, 5V USB uwea) a me ka hoʻouna ʻana i nā hōʻailona wikiwiki no nā mea ʻike.
- Mechanical Ductility: Elongation ≥30% (25 ℃) a me ka ikaika tensile ≥200 MPa. Hiki ke pale i ka piko pinepine (180° bend test ≥10 mau manawa me ka haki ʻole) no ka uwea ʻana i nā wahi paʻa (e laʻa, nā keʻena o loko, nā pilina lihi PCB).
2. 3-5μ Precision Tin Coating: Hoʻopale ʻia
- Pale Anati-Oxidation: Hoʻopaʻa ʻia ka ea/makū mai ka hoʻopili ʻana i ke keleawe, ka pale ʻana i ka hoʻokumu ʻana o ke keleawe keleawe conductive (CuO/Cu₂O). ʻOiai i loko o 80% humidity no 12 mau mahina, mālama ka uea i ka ≥97% conductivity mua (vs. ke keleawe ʻole: hāʻule i 85% i 3 mau mahina).
- Hoʻonui Solderability: ʻO ka wahi hehee haʻahaʻa o ka tin (232 ℃) hiki ke “hoʻomaʻū koke” i ka wā e kūʻai aku ai—ʻaʻole pono ka hoʻomaʻemaʻe mua ʻana a i ʻole ka hoʻoulu ʻana o ka flux. E ho'ēmi i ka manawa hui PCB e 40% vs. ke keleawe kala ʻole (e pono ke hoʻoneʻe ʻia o ka oxide ma o ka sanding/kemika).
- Hoʻolālā Mānoanoa Kaulike: ʻAʻole hiki i ka mānoanoa 3-5μ ke uhi i ʻelua mau mea ʻoi loa: ʻaʻole hiki i nā uhi ʻoi aku ka lahilahi (<3μ) ke uhi i nā hemahema keleawe, ʻoiai nā uhi mānoanoa (> 5μ) e hoʻoheheʻe ʻia ka uea (pili i ka pohā i ka wā e kulou ana).
Nā Kūlana ʻenehana
| ʻĀpana | Waiwai kiko'ī |
| Anawaena inoa (Ka holoʻokoʻa) | 1.0mm (mea hoʻokele: ~ 0.992-0.994mm; ka uhi pahu: 3-5μ) |
| Hoʻomanawanui anawaena | ±0.02mm |
| ʻO ka mānoanoa o ka pā | 3μ (ka liʻiliʻi) - 5μ (kiʻekiʻe); kūlike mānoanoa: ≥95% (ʻaʻohe wahi <2.5μ) |
| Ka hoʻoheheʻe uila (20 ℃) | ≥98% IACS |
| Ikaika U'i | 200-250 MPa |
| Elongation ma ka Haka | ≥30% (L0=200mm) |
| Hoʻopili kino | ʻAʻohe ʻili/ʻili ʻana ma hope o ka piʻo ʻana o 180° (radius=5mm) + hoʻāʻo lipine (3M 610 lipine, ʻaʻohe koena tin) |
| Pale ʻino | Holo i ka ASTM B117 ho'āʻo paʻakai paʻakai (48h, 5% NaCl, 35 ℃) - ʻaʻohe ʻula ʻulaʻula, ʻeleʻele ʻeleʻele. |
| Kaulana Mahana Hana | -40 ℃ (hoʻololi haʻahaʻa haʻahaʻa, ʻaʻohe māwae) i 105 ℃ (hoʻohana mau ʻia, ʻaʻohe hoʻoheheʻe tin) |
Hoʻolako Huahana & Hoʻopilikino
| 'ikamu | Hōʻike |
| Palapala Hoolako | Mea alakaʻi paʻa (maʻamau); ka mea alakaʻi pae ʻia (maʻamau: 7/0.43mm, 19/0.26mm) |
| Hoʻonohonoho ʻāwili | 500m/1000m no ka spool (mea spool: ABS plastic, anawaena: 200mm, puka kumu: 50mm) |
| Hoʻopau ʻili | ʻO ke kīʻaha kukui (paʻamau); ʻūhā matte (maʻamau, no nā noi anti-glare) |
| Hoʻoponopono hou | ʻO ka hoʻokaʻawale koho (PVC/XLPE/Silicone, mānoanoa: 0.1-0.3mm, kala: ʻeleʻele/ʻulaʻula/uliuli) |
| Hoʻopili ʻia | ʻeke ʻeke alumini i hoʻopaʻa ʻia me ka ʻeke (moisture-proof) + pahu pahu waho (me ka desiccant, anti-impact) |
Nā hiʻohiʻona noi maʻamau
- Na lako hale: ʻO nā uwila kūloko no nā mīkini holoi (kū ʻole i ka haʻahaʻa), nā pahu hau (hiki i ka wela haʻahaʻa), a me nā umu microwave (kū pale i ka wela a hiki i 105 ℃).
- Kaʻa uila: Nā pahu hoʻohui no nā ʻōhua kaʻa (anti-corrosion), uwila ʻike (hōʻailona kūpaʻa), a me nā ʻōnaehana infotainment i loko o ke kaʻa (ke hāʻule kaila haʻahaʻa).
- PCB a me nā mea uila uila: Ke kuʻi ʻana ma waena o nā puka no nā papa Arduino/Raspberry Pi, nā mea hoʻokele uwea USB-C, a me nā uwila ʻāwīwī LED (hui maʻalahi).
- Ka Mana Hana: Wiring no PLC panels (industrial humidity resistance) a me ka haʻahaʻa-voltage lako mana (liʻiliʻi ikehu poho).
- Na Lapaau Lapaau: ʻO nā uwea kūloko no nā mea hana diagnostic portable (lead-free, compliant with biocompatibility standards) a me nā pamu lāʻau lapaʻau liʻiliʻi (flexible bending).
Hōʻoia maikaʻi mai ka Tankii Alloy Material
ʻO kēlā me kēia pūʻulu o1.0mm uwea keleawe tinnedʻekolu mau manaʻo nui:
- Ho'āʻo Mānoanoa Tin: X-ray fluorescence (XRF) Analyzer (pololei: ± 0.1μ) - 5 sampling points no spool.
- Ho'āʻo Conductivity: ʻEhā-helu hōʻike hōʻike (pololei: ± 0.5% IACS) - 3 mau laʻana no kēlā me kēia pūʻulu.
- Hoao Mechanical: Mīkini hoʻāʻo honua (tensile/elongation) + bend tester (adhesion) - 2 laʻana i kēlā me kēia pūʻulu.
Loaʻa nā laʻana manuahi (1m lōʻihi, 2-3 mau ʻāpana no kēlā me kēia kikoʻī) a me nā hōʻike hōʻike hōʻike kikoʻī (MTR) i loaʻa ma ke noi. Hāʻawi kā mākou hui ʻenehana i ke kākoʻo 1-a-1 no nā koi maʻamau (e laʻa, ke koho ʻana i nā mea insulation no nā noi wela kiʻekiʻe, ka hoʻolālā alakaʻi stranded no nā uwea maʻalahi).
E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou
-
Kelepona
-
leka uila
-
Whatsapp
-
WeChat
Judy
150 0000 2421
-
luna