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ʻO Tankii 1.0mm Tinned Copper Wire T2 ʻUlaʻula Copper Anti-Oxidation & Excellent Conductivity

Wehewehe Pōkole:


  • Inoa Huahana:Uea Keleawe i hoʻopaʻa ʻia
  • Anawaena:1.0mm
  • Ke anawaena o ke ahonui:±0.02mm
  • Mānoanoa o ka uhi ʻana o ka tin:3-5μ
  • Ka Hoʻokele Uila (20℃):≥98% IACS
  • Ikaika Hoʻopaʻa:200-250 MPa
  • Elongation i ka wā hoʻomaha:≥30% (L0=200mm)
  • Pae Mahana Hana:-40℃~150℃
  • Nā kikoʻī huahana

    Nā nīnau i nīnau pinepine ʻia

    Nā Lepili Huahana

    Wehewehe Huahana

    Uea Keleawe Paʻa 1.0mm (ʻUpena Keleawe ʻUlaʻula Maʻemaʻe, Uhi Paʻa 3-5μ)

    ʻIke Huahana

    Ma ke ʻano he alakaʻi uila hilinaʻi kiʻekiʻe mai Tankii Alloy Material, ʻo ka1.0mm uea keleawe i hoʻopaʻa ʻiaHoʻohui i ʻelua mau pono koʻikoʻi: ka conductivity ultra-kiʻekiʻe o ke keleawe ʻulaʻula maʻemaʻe (T2 grade) a me ka pale anti-corrosion o kahi uhi tin precision 3-5μ. Hana ʻia ma o ke kaʻina hana tinning hoʻomau hoʻomau a Huona—i lako me ka nānā ʻana i ka mānoanoa manawa maoli a me ka kaohi mahana—hōʻoia ka uea e pili pono ana ka papa tin i ka ʻiwi keleawe paʻa 1.0mm, ʻaʻohe lua a i ʻole nā ​​​​kiko lahilahi. Hoʻoponopono ia i ʻelua mau pilikia koʻikoʻi o ka uea keleawe ʻōlohelohe: ka emi ʻana o ka conductivity i hoʻokomo ʻia e ka oxidation a me ka solderability maikaʻi ʻole, e lilo ia i mea nui no nā pilina uila e pono ai ke kūpaʻa lōʻihi, ka ʻākoakoa maʻalahi, a me ke kūʻē ʻana i nā wahi humid/ʻoihana.

    Nā Palapala Hōʻoia Kūlana & Mea Hana

    • Papa Alakaʻi: Keleawe ʻulaʻula maʻemaʻe T2 (kūlike me GB/T 3956-2008; like me ASTM B33, IEC 60288 Papa 1)
    • Ka Uhi ʻana o ka Tin Standard: GB/T 4910-2009, IEC 60317-2 (ʻaʻohe kēpau: Pb ≤0.005%, Sn ≥99.9%)
    • Nā Palapala Hōʻoia Kūlana: Hoʻokō ʻo RoHS 2.0, ʻōnaehana hoʻokele maikaʻi ISO 9001, ʻae ʻia ka hoʻāʻo kaiapuni SGS
    • Mea HanaʻO ka Tankii Alloy Material (15+ mau makahiki o ka ʻike hana ʻana i ke alakaʻi keleawe)

    Nā Pōmaikaʻi Hana Koʻikoʻi

    1. Alakaʻi Keleawe ʻUlaʻula Maʻemaʻe: Alakaʻi Kūlike ʻole

    • Ka Hoʻokele Uila: ≥98% IACS (20 ℃), ʻoi aku ka nui ma mua o ke keleawe i hoʻohui ʻia (e laʻa, nā mea hoʻohui CuNi: ~20% IACS) a me ka alumini (61% IACS). Hōʻoia i ka emi iki o ka voltage i nā kaapuni voltage haʻahaʻa (e laʻa, nā uwea kaʻa 12V, nā kaula USB 5V) a me ka hoʻoili wikiwiki ʻana i nā hōʻailona no nā mea ʻike.
    • Ka Ductility Mechanical: Elongation ≥30% (25 ℃) a me ka ikaika tensile ≥200 MPa. Hiki ke kū i ke kūlou pinepine ʻana (hoʻāʻo kūlou 180° ≥10 mau manawa me ka ʻole o ka haki ʻana) no nā uea ma nā wahi paʻa (e laʻa, nā keʻena kūloko o ka mīkini, nā pilina lihi PCB).

    2. 3-5μ Precision Tin Coating: Palekana i kuhikuhi ʻia

    • Pale Pale ʻOkika: Pale ka papa kini mānoanoa i ka ea/ka makū mai ka hoʻopili ʻana i ke keleawe, e pale ana i ka hoʻokumu ʻia ʻana o ka oxide keleawe alakaʻi (CuO/Cu₂O). ʻOiai i ka 80% ka makū no 12 mau mahina, mālama ka uea i ka conductivity mua ≥97% (vs. keleawe ʻōlohelohe: hāʻule i 85% i loko o 3 mau mahina).
    • Hoʻonui ʻia ka SolderabilityʻO ke kiko heheʻe haʻahaʻa o Tin (232 ℃) e hiki ai ke "hoʻomaʻū koke" i ka wā o ke kūʻai ʻana—ʻaʻohe pono o ka hoʻomaʻemaʻe mua a i ʻole ka hoʻāla ʻana o ka flux. Hoʻemi i ka manawa ʻākoakoa PCB ma 40% vs. ke keleawe ʻōlohelohe (pono e wehe ʻia ka oxide ma o ke one/kemika).
    • Hoʻolālā Mānoanoa Kaulike: ʻO ka mānoanoa 3-5μ e pale aku i ʻelua mau ʻaoʻao loa: ʻaʻole hiki i nā uhi lahilahi (<3μ) ke uhi i nā kīnā keleawe, ʻoiai ʻo nā uhi mānoanoa (>5μ) e hoʻolilo i ka uea i palupalu (hiki ke nahā i ka wā e kūlou ana).

    Nā Kikoʻī ʻenehana

    Palena
    Waiwai kikoʻī
    Anawaena Nominal (Hōʻuluʻulu)
    1.0mm (alakaʻi: ~0.992-0.994mm; uhi tin: 3-5μ)
    Ke ahonui ʻana o ke anawaena
    ±0.02mm
    Mānoanoa o ka uhi ʻana o ka tin
    3μ (ka palena iki) – 5μ (ka palena kiʻekiʻe); ʻano like o ka mānoanoa: ≥95% (ʻaʻohe kiko <2.5μ)
    Ka Hoʻokele Uila (20 ℃)
    ≥98% IACS
    Ikaika Hoʻopaʻa
    200-250 MPa
    Elongation i ka wā hoʻomaha
    ≥30% (L0=200mm)
    Hoʻopili ʻana o ka tin
    ʻAʻohe ʻili/ʻōniʻoniʻo ma hope o ke kūlou ʻana o 180° (radius=5mm) + hoʻāʻo lipine (lipine 3M 610, ʻaʻohe koena tin)
    Ke kū'ē ʻana i ka palaho
    Ua hala i ka hoʻāʻo pīpī paʻakai ASTM B117 (48h, 5% NaCl, 35 ℃) - ʻaʻohe ʻulaʻula ʻōpala, pehu tin
    Pae Mahana Hana
    -40 ℃ (ka maʻalahi o ka mahana haʻahaʻa, ʻaʻohe haki) a i 105 ℃ (hoʻohana mau, ʻaʻohe heheʻe tin)

    Hoʻolako Huahana & Hoʻopilikino ʻana

    Mea
    Nā kikoʻī
    Palapala Hoʻolako
    Alakaʻi paʻa (maʻamau); alakaʻi wili (maʻamau: 7/0.43mm, 19/0.26mm)
    Hoʻonohonoho ʻana o ka spool
    500m/1000m no kēlā me kēia spool (mea spool: plastik ABS, anawaena: 200mm, lua kumu: 50mm)
    Hoʻopau ʻili
    Pahu ʻālohilohi (paʻamau); pahu matte (maʻamau, no nā noi anti-glare)
    Nā Lapaʻau ʻē aʻe
    Palena koho (PVC/XLPE/Silicone, mānoanoa: 0.1-0.3mm, kala: ʻeleʻele/ʻulaʻula/polū)
    Ka hoʻopili ʻana
    ʻEke pepa alumini i hoʻopaʻa ʻia i ka vacuum (pale i ka wai) + pahu waho (me ka desiccant, anti-impact)

    Nā hiʻohiʻona noi maʻamau

    • Nā Mea Hana HaleNā uea kūloko no nā mīkini holoi (kū i ka makū), nā pahu hau (kū i ka mahana haʻahaʻa), a me nā umu microwave (kū i ka wela a hiki i 105℃).
    • Nā ʻElekole KaʻaNā kikowaena hoʻohui no nā pila kaʻa (anti-corrosion), nā uwea sensor (hōʻailona paʻa), a me nā ʻōnaehana infotainment i loko o ke kaʻa (hāʻule haʻahaʻa voltage).
    • PCB & Nā Uila Mea kūʻai aku: Ke kūʻai ʻana ma waena o nā puka no nā papa Arduino/Raspberry Pi, nā alakaʻi kaula USB-C, a me nā uwea LED strip (maʻalahi ka ʻākoakoa).
    • Mana ʻOihana: Ke uwea no nā panela PLC (ke kū'ē ʻana i ka makū ʻoihana) a me nā lako mana haʻahaʻa-voltage (ka pohō ikehu liʻiliʻi).
    • Nā Mea Lapaʻau: Nā uea kūloko no nā mea hana hōʻoia lawe lima (ʻaʻohe kēpau, kūlike me nā kūlana biocompatibility) a me nā pamu lapaʻau liʻiliʻi (kūlou palupalu).

    Hōʻoiaʻiʻo maikaʻi mai ka Tankii Alloy Material

    ʻEkolu mau nānā koʻikoʻi e hana ʻia ana i kēlā me kēia pūʻulu o ka uea keleawe tinned 1.0mm:
    1. Hoʻāʻo Mānoanoa Tin: Mea kālailai fluorescence X-ray (XRF) (pololei: ±0.1μ) – 5 mau kiko laʻana no kēlā me kēia spool.
    1. Hoʻāʻo AlakaʻiMea hoʻāʻo ʻimi ʻehā kiko (pololei: ±0.5% IACS) - 3 mau laʻana no kēlā me kēia pūʻulu.
    1. Hoʻāʻo MīkiniMīkini hoʻāʻo honua (tensile/elongation) + mea hoʻāʻo kūlou (adhesion) - 2 mau laʻana no kēlā me kēia pūʻulu.
    Loaʻa nā laʻana manuahi (1m ka lōʻihi, 2-3 ʻāpana no kēlā me kēia kikoʻī) a me nā hōʻike hoʻāʻo mea kikoʻī (MTR) ma ke noi. Hāʻawi kā mākou hui loea i ke kākoʻo 1-ma-1 no nā koi maʻamau (e laʻa, ke koho ʻana i nā mea insulation no nā noi wela kiʻekiʻe, ka hoʻolālā alakaʻi stranded no nā uea maʻalahi).

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