Wehewehe Huahana

TM-1 Bimetallic Strip (0.1mm Mānoanoa × 100mm Laulā)

ʻIke Huahana

Nā Hoʻonohonoho Maʻamau a me ka Hoʻonohonoho Koʻikoʻi

• Papa Huahana: TM-1 (papa bimetallic kūikawā, i hana ʻia no ka pane wela ʻana o ke ana lahilahi loa)
• Kikoʻī Ana: mānoanoa 0.1mm (ʻae ʻia: ±0.003mm) × laulā 100mm (ʻae ʻia: ±0.15mm)
• ʻAno Hui Pū ʻIa: ʻO ka maʻamau, he papa hoʻonui kiʻekiʻe (e laʻa, Cu-Mn-Zn alloy, α≈20 × 10⁻⁶ / ℃) a me kahi papa hoʻonui haʻahaʻa (e laʻa, Fe-Ni 36 alloy, α≈1.6 × 10⁻⁶ / ℃), me ka ikaika ʻoki interfacial ≥145 MPa (i hoʻāʻo ʻia no GB / T 14985)
• Nā Kūlana Kūlike: Pili i ka GB/T 14985-2017 (kūlana Kina noʻāpana bimetallics) a me IEC 60694 no nā ʻāpana kaohi wela
• Mea Hana: Tankii Alloy Material, i hōʻoia ʻia e ISO 9001 a me ISO 14001, me nā hiki ke ʻōwili lahilahi a me ka ʻoki pololei i loko o ka hale

Nā Pōmaikaʻi Koʻikoʻi (vs. Nā ʻĀpana Bimetallic Maʻamau a me ka Mānoanoa)

1. ʻO ka pololei loa: ʻO ka mānoanoa 0.1mm (30% lahilahi ma mua o nā kaha 0.15mm maʻamau) e hiki ai ke hoʻohui ʻia i loko o nā micro-devices (e laʻa me nā sensor hiki ke hoʻokomo ʻia, nā mea haki kaapuni miniaturized) me ka mālama ʻana i ka like ʻana o ka mānoanoa paʻa (± 0.003mm) e pale aku i ka deformation thermal like ʻole.
2. Hoʻonui ʻia ka ʻike wela: Hāʻawi ka lakio coefficient hoʻonui kiʻekiʻe (~12.5:1) i kahi curvature i hoʻoulu ʻia e ka mahana o 12-15 m⁻¹ (ma 100 ℃ vs. 25 ℃) - 20% kiʻekiʻe ma mua o nā ʻāpana mānoanoa (0.3mm+), e hōʻoiaʻiʻo ana i ka hana wikiwiki i nā mea hana mana haʻahaʻa.
3. Ka laulā nui no ka hana ʻana i ka batch: kūlike ka laulā maʻamau 100mm i nā nui o nā panela stamping ʻoihana, e ʻae ana i ka hana like ʻana o 50+ mau ʻāpana micro (e laʻa, nā pilina thermostat) no kēlā me kēia kaha—e hoʻemi ana i ka manawa hana ma 40% vs. nā kaha ākea haiki.
4. Hoʻopili Interfacial Ikaika: Hoʻopau ka ʻenehana hoʻopili diffusion ponoʻī i ka delamination ʻoiai ma hope o 8,000 mau pōʻaiapuni thermal (-40℃ a i 180℃) - e hoʻoponopono ana i ka pilikia maʻamau o nā bimetallics lahilahi (≤0.1mm) e maʻalahi ana i ka hoʻokaʻawale ʻana o ka papa.
5. ʻO ka hiki ke hana mīkini maikaʻi loa: ʻO ke ana lahilahi loa e hiki ai ke ʻoki laser i nā ʻano liʻiliʻi paʻakikī (ka nui o ka hiʻohiʻona liʻiliʻi: 0.5mm) a me ke kulou paʻa (radius ≥1 × mānoanoa) me ka ʻole o ka haki ʻana—koʻikoʻi no ka ʻākoakoa ponoʻī o nā mea paʻa.

Nā Kikoʻī ʻenehana

Nā kikoʻī huahana

Nā Hoʻohana Maʻamau

• Nā Micro-Thermostat: Ka hoʻomalu ʻana i ka mahana i nā mea hiki ke komo (e like me nā uaki akamai), nā mea hoʻoluʻolu insulin lapaʻau, a me nā ʻōnaehana HVAC miniaturized (kūpono ka mānoanoa 0.1mm i nā hoʻolālā lahilahi).
• Ka Palekana ʻana i ka Wela Kiʻekiʻe: Nā mea haki kaapuni no nā pila lithium-ion (e like me nā pila drone, nā pepeiao pepeiao uea ʻole) a me nā micro-motors (pale ka hoʻāla wikiwiki ʻana i ka holo ʻana o ka wela).
• ʻIke ʻĀpana Nui: Nā ʻāpana profiling thermal no nā papa PCB (uhi ka laulā 100mm i nā ʻāpana he nui) a me nā mea uila maʻalahi (pane mahana like ma ke kaha).
• Nā Uila Mea kūʻai aku: Nā mea hoʻoikaika wela no nā poho wela kamepiula lawe, nā mana hoʻomalu fuser mīkini paʻi, a me nā modula pale pila kelepona akamai.
• Nā Hana Liʻiliʻi ʻOihana: Nā shim e hoʻoponopono ana i ka mahana no nā mea ʻike MEMS (e laʻa me nā mea ʻike kaomi i nā kaʻa kūʻokoʻa) a me nā kuapo wela liʻiliʻi no nā mea hana IoT.