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ʻO Ultra – Thin In – Stock CuNi44 Foil 0.0125mm mānoanoa x 102mm Wide High Precision & Corrosion Resistance
Hōʻike huahana
CuNi44 Foil (0.0125mm Mānoanoa × 102mm Laulā)
Nānā Huahana
CuNi44 foil(0.0125mm × 102mm), kēia mea keleawe-nickel resistance alloy, i ʻike ʻia ʻo constantan, i ʻike ʻia e ke kūpaʻa uila kiʻekiʻe.
hui pū ʻia me kahi koena wela liʻiliʻi o ke kūpaʻa. Hōʻike pū kēia alloy i ka ikaika tensile kiʻekiʻe
a me ke kū'ē i ka ʻino. Hiki ke hoʻohana ʻia ma nā mahana a hiki i 600°C i ka ea.
hui pū ʻia me kahi koena wela liʻiliʻi o ke kūpaʻa. Hōʻike pū kēia alloy i ka ikaika tensile kiʻekiʻe
a me ke kū'ē i ka ʻino. Hiki ke hoʻohana ʻia ma nā mahana a hiki i 600°C i ka ea.
Hoʻokohu maʻamau
- Papa Alloy: CuNi44 (Copper-Nickel 44)
- Helu UNS: C71500
- Nā Kūlana Kūikawā: Kūlike me DIN 17664, ASTM B122, a me GB/T 2059
- Nānā Manaʻo: 0.0125mm mānoanoa × 102mm laula
- Mea Hana: Tankii Alloy Material, i hōʻoia ʻia i ka ISO 9001 no ka hoʻoili ʻana i nā mea hao
Nā Pōmaikaʻi Nui (vs. CuNi44 Foils)
Ke kū nei kēia 0.0125mm × 102mm CuNi44 foil no kāna hoʻolālā ultra-thin a paʻa-ākea i manaʻo ʻia:
- ʻO ka Ultra-Thin Precision: 0.0125mm mānoanoa (e like me 12.5μm) loaʻa i ka lahilahi alakaʻi ʻoihana, hiki i ka miniaturization o nā mea uila me ka ʻole o ka kaumaha ʻana i ka ikaika mechanical.
- Hana Kū'ē Paʻa: Resistivity o 49 ± 2 μΩ·cm ma 20 ° C a me ka helu haʻahaʻa haʻahaʻa o ke kū'ē (TCR: ± 40 ppm / ° C, -50 ° C a hiki i 150 ° C) - e hōʻoia i ka emiʻana o ke kū'ēʻana i nā hiʻohiʻona ana kiʻekiʻe,ʻoi aku ka lahilahi o nā foils non-alloy.
- Mana Mana Manawa: ʻO ka mānoanoa o ka ± 0.0005mm a me ka laulā o ka ± 0.1mm (102mm ka laulā paʻa) e hoʻopau i ka ʻōpala waiwai i nā laina hana automated, e hōʻemi ana i nā kumukūʻai post-processing no nā mea kūʻai.
- ʻAno maikaʻi loa: ʻO ka ductility kiʻekiʻe (elongation ≥25% i ka mokuʻāina annealed) hiki i ka micro-stamping a me ka etching paʻakikī (e laʻa, nā pahu pale pale maikaʻi) me ka ʻole o ka pohā-koʻikoʻi no ka hana uila pololei.
- Kū'ē Kū'ē: Holo i 500-hola ASTM B117 i ka ho'āʻo paʻakai paʻakai me ka liʻiliʻi o ka oxidation, e hōʻoia ana i ka hilinaʻi lōʻihi ma nā wahi kemika haʻahaʻa.
ʻIkepili ʻenehana
| ʻAno | Waiwai |
|---|---|
| Ka Hui Kemika (wt%) | Ni: 43 – 45 % Cu: koena Mn: ≤1.2 % |
| mānoanoa | 0.0125mm (hoʻomanawanui: ±0.0005mm) |
| Laulā | 102mm (hoʻomanawanui: ±0.1mm) |
| Ka huhū | Annealed (māmā, no ka hana maʻalahi) |
| Ikaika U'i | 450-500 MPa |
| Elongation (25°C) | ≥25% |
| Paʻakiki (HV) | 120-140 |
| Kū'ē (20°C) | 49 ± 2 μΩ·cm |
| ʻO ʻAla ʻili (Ra) | ≤0.1μm (hoʻopau annealed mālamalama) |
| Kaulana Mahana Hana | -50°C a 300°C (hoʻohana mau) |
Nā Kūlana Huahana
| 'ikamu | Hōʻike |
|---|---|
| Hoʻopau ʻili | ʻAʻohe ʻaila i koena |
| Palapala Hoolako | ʻO nā ʻōwili mau (lōʻihi: 50m-300m, ma nā wili plastik 150mm) |
| Palahalaha | ≤0.03mm/m (koʻikoʻi no ka hoʻopaʻa ʻana like) |
| Etchability | Hoʻohālikelike me nā kaʻina hana etching acid maʻamau (e laʻa, ferric chloride solutions) |
| Hoʻopili ʻia | Hoʻopaʻa ʻia ʻo Vacuum i nā ʻeke alumini anti-oxidation me nā desiccants; pahu pahu waho me ka huʻa haʻalulu |
| Hoʻopilikino | ʻO ka uhi anti-tarnish koho; ʻokiʻoki i ka lōʻihi (1m ka liʻiliʻi); nā lōʻihi ʻōwili i hoʻoponopono ʻia no nā laina ʻakomi |
Nā noi maʻamau
- Micro-Electronics: Nā pale kiʻiʻoniʻoni lahilahi, nā shunts o kēia manawa, a me nā mea potentiometer i nā mea hiki ke hoʻohana ʻia, nā smartphones, a me nā mea ʻike IoT (0.0125mm mānoanoa e hiki ai i ka hoʻolālā PCB compact).
- Nā Ana Paʻa: ʻO nā mākia kānana ʻano kiʻekiʻe (102mm ka laula i kūpono i nā panela hana ana maʻamau) no ka hoʻouka ʻana a me ka nānā ʻana i ke kaumaha.
- Nā Lapaʻau Lapaʻau: ʻO nā mea hoʻomehana liʻiliʻi a me nā ʻāpana sensor i nā mea implantable a me nā mea hana diagnostic portable (ʻo ke kūpaʻa corrosion e hōʻoia i ka biocompatibility me nā wai kino).
- Aerospace Instrumentation: ʻO nā ʻāpana kūʻē pololei i nā avionics (hana paʻa ma lalo o nā loli wela ma nā kiʻekiʻe kiʻekiʻe).
- ʻEleke uila hikiwawe: Nā papa hoʻokele i nā PCB maʻalahi a me nā hōʻike foldable (kākoʻo ka ductility i ke kulou mau ʻana).
Hoʻohana ʻo Tankii Alloy Material i ka mana koʻikoʻi no kēia pepa CuNi44 ultra-thin: e hana ana kēlā me kēia pūʻulu i ke ana mānoanoa (ma o laser micrometer), ka hoʻopili ʻana i nā mea kemika (XRF), a me ka hoʻāʻo kūpaʻa kūʻē. Loaʻa nā laʻana manuahi (100mm × 102mm) a me nā hōʻike hōʻike kikoʻī kikoʻī (MTR) ma ke noi. Hāʻawi kā mākou hui ʻenehana i ke kākoʻo i hoʻohālikelike ʻia - me nā ʻōlelo aʻoaʻo etching parameter a me nā alakaʻi mālama mālama anti-oxidation - e kōkua i nā mea kūʻai aku e hoʻonui i ka hana o kēia foil pololei i nā hiʻohiʻona micro-manufacturing.
E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou
