New Cound Randeal Coper Nickel Alloy 6j11 ribbon 0.4 * 2mm
Thancecture | Resistivity (200c μ μ. M) | Max. Ke hana nei (0c) | Ikaika ikaika (MPA) | Melting Point (0c) | Density (g / cm3) | TCR X10-6 / 0C (20 ~ 600 0C) | Hana Emf vs Cu (μ V / 0c) (0 ~ 100 0C) |
Alloy nonemenclare | |||||||
NC003 (Cuni1) | 0.1 | 200 | ≥ 250 | 1095 | 8.9 | <100 | -12 |
Nā Pūnaewele Pūnaewele | Metric | Nā manaʻo'ōlelo |
Huakai | 8.94 g / cc | |
Nā Pīkuhi Propertinies | Metric | Nā manaʻo'ōlelo |
ʻO ka ikaika ikaika, hope loa | 262 - 5361 mpa | |
Ka ikaika o ka ikaika, he hopena | 276 - 524 mHO | Ke hilinaʻi nei i ka huhū |
Elongation ma ka wā hoʻomaha | 46.0% | i 50.8 mm. |
Modulus olasticity | 115 GPA | |
Possons ka laulā | 0.310 | Heluʻia |
Markinpalibility | 20% | UND C36000 (FREE-FREE CILL) = 100% |
Shear modlulus | 44.0 gpa | |
Waiwai waiwai | Metric | Nā manaʻo'ōlelo |
ʻO keʻano o ka uila | 0.000012020 Ohm-cm @Tempeir 20.0 ° C | |
Nā'lelo Thermal | Metric | Nā manaʻo'ōlelo |
Cte, Linear | 17.5 μ M / M- ° C @Tempeiulina 20.0 - 300 ° C | |
ʻO ka mana wela | 0.380 J / G- ° C | |
Ka HōʻaʻO Kokua | 64.0 w / mk @Tempeir 20.0 ° C | |
Malting Point | <= 1125 ° C | Wai wai |
Wai wai | 1125 ° C | |
Hoʻololi i nā waiwai | Metric | Nā manaʻo'ōlelo |
ʻO kahi wela | 565 - 815 ° C | |
Wela wela wela | 815 - 950 ° C | |
Nā mea waiwai waiwai | Metric | Nā manaʻo'ōlelo |
, Keleawe, Cu | > = 91.2% | |
'Uslelo hao, Fe | 1.30 - 1.70% | |
Kipa, pb | <= 0.050% | |
Mangeanse, MN | 0.30 - 0.80% | |
Nickel, ni | 4.80 - 6.20% | |
Zecc, zn | <= 1.0% |
Cuni44 speical contacilege,%
Ni | Mn | Fe | Si | Cu | MAKAU NOIA | Kuhikuhi kuhikuhi | |||
Cd | Pb | Hg | Cr | ||||||
44 | 1% | 0,5 | - | Bal | - | ND | ND | ND | ND |
Nā Pīkuhi Propertinies
ʻO ka lawelaweʻo Max hoʻomau | 400ºc |
Ke kipi i ka 20ºC | 0.49 ± 5% ohm mm2 / m |
Huakai | 8.9 g / cm3 |
Ka HōʻaʻO Kokua | -6 (max) |
Malting Point | 1280ººccc |
ʻO ka ikaika ikaika,ʻo N / MM2 Anne i hoʻopaʻaʻia, palupalu | 340 ~ 535 Mpa |
ʻO ka ikaika o ka ikaika, n / mm3 maloʻo maloʻo | 680 ~ 1070 mPA |
Elongation (anneal) | 25% (min) |
Elongation ('ōwili maloʻo) | ≥Min) 2% (min) |
EmF vs Cu, μV / ºc (0 ~ 100ºC) | -43 |
ʻO ka hoʻolālā micrographic | Austente |
Waiwai magnetic | Non |