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Ka Uea Paa Paa Kopa Nikela Alloy 6j40 Lipine 0.4*2mm
Uea Paa Paa Konstantana Hou 6j11 Lipine Copper Nickel Alloy 0.4*2mm
| ʻano ʻano | Kū'ē (200C μ Ω. m) | Max.Ka wela hana (0C) | Ikaika U'i (Mpa) | Ka helu hehee (0C) | ʻOi (g/cm3) | TCR x10-6/ 0C (20~600 0C) | EMF vs Cu (μ V/ 0C) (0~100 0C) |
| Alloy Nomenclature | |||||||
| NC003 (CuNi1) | 0.1 | 200 | ≥ 250 | 1095 | 8.9 | < 100 | -12 |
| Na Waiwai Kino | Metric | Nā Manaʻo |
| ʻO ka mānoanoa | 8.94 g/cc | |
| Na Waiwai Mechanical | Metric | Nā Manaʻo |
| Ikaika U'i, Loa | 262 – 531 MPa | |
| Ikaika U'i, Hua | 276 – 524 MPa | Ma muli o ka huhū |
| Elongation ma ka Haka | 46.0 % | i 50.8 mm. |
| Modulus o Elasticity | 115 GPa | |
| Poissons Ratio | 0.310 | Heluhelu |
| Mīkini | 20 % | UNS C36000 (ke keleawe ʻoki manuahi) = 100% |
| ʻO ka hoʻoheheʻe ʻana | 44.0 GPa | |
| Na Waiwai Uila | Metric | Nā Manaʻo |
| Kū'ē Uila | 0.0000120 ohm-cm @Ka wela 20.0 ° C | |
| Waiwai wela | Metric | Nā Manaʻo |
| CTE, laina laina | 17.5 µ m/m-° C @Ka wela 20.0 – 300 ° C | |
| Kaha Wela Kūikawā | 0.380 J/g-° C | |
| ʻO ka hoʻoili wela | 64.0 W/mK @Ka wela 20.0 ° C | |
| Lae hehee | < = 1125 ° C | Liquidus |
| Liquidus | 1125 ° C | |
| Mea Hana Hana | Metric | Nā Manaʻo |
| Anaaling Mahana | 565 – 815 ° C | |
| Wela Hana Hana | 815 – 950 ° C | |
| Nā Pono Mea Hui | Metric | Nā Manaʻo |
| Ke keleawe, Cu | > = 91.2 % | |
| Hao, Fe | 1.30 – 1.70 % | |
| Lead, Pb | < = 0.050 % | |
| Manganese, Mn | 0.30 – 0.80 % | |
| Nikela, Ni | 4.80 – 6.20 % | |
| Zinc, Zn | < = 1.0 % |
CuNi44 Mea Kimia, %
| Ni | Mn | Fe | Si | Cu | 'ē aʻe | Kuhikuhi ROHS | |||
| Cd | Pb | Hg | Cr | ||||||
| 44 | 1% | 0.5 | - | ʻO Bal | - | ND | ND | ND | ND |
Na Waiwai Mechanical
| Max Hoʻomau lawelawe Temp | 400ºC |
| ʻO ke kūpaʻa ma 20ºC | 0.49±5%ohm mm2/m |
| ʻO ka mānoanoa | 8.9 g/cm3 |
| ʻO ka hoʻoili wela | -6(Max) |
| Lae hehee | 1280ºC |
| Ikaika U'i, N/mm2 Annealed, Malū | 340~535 Mpa |
| Ikaika U'i, N/mm3 Ka'a anu | 680~1070 Mpa |
| Elongation(anneal) | 25%(Min) |
| Elongation (cold rolled) | ≥Min)2%(Min) |
| EMF vs Cu, μV/ºC (0~100ºC) | -43 |
| Hoʻolālā Micrographic | austenite |
| Waiwai Magnetic | ʻAʻole |
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